Electroplating current profile effects on deposited Cu

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.advisor Ross, Glenn
dc.contributor.author Heikkilä, Niklas
dc.date.accessioned 2016-01-20T15:35:02Z
dc.date.available 2016-01-20T15:35:02Z
dc.date.issued 2016-01-07
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/19446
dc.format.extent 31
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.title Electroplating current profile effects on deposited Cu en
dc.type G1 Kandidaatintyö fi
dc.contributor.school Sähkötekniikan korkeakoulu fi
dc.subject.keyword copper en
dc.subject.keyword electroplating en
dc.subject.keyword prc en
dc.subject.keyword pc en
dc.identifier.urn URN:NBN:fi:aalto-201601211094
dc.type.dcmitype text en
dc.programme.major Bioinformaatioteknologia fi
dc.programme.mcode S121 fi
dc.programme.mcode ELEC3016 en
dc.type.ontasot Bachelor's thesis en
dc.type.ontasot Kandidaatintyö fi
dc.contributor.supervisor Turunen, Markus
dc.programme Bioinformaatioteknologia BIO fi


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