Ramp-up of Printed Circuit Board Assemblies and Box-builds



Title:	Ramp-up of Printed Circuit Board Assemblies and Box-builds Ramp-up av kretskort och box-builds
Author(s):	Fant, Johan
Date:	2015-06-10
Language:	en
Pages:	7+53
Major/Subject:	Elektroniikka ja sovellukset
Degree programme:	EST - Elektroniikka ja sähkötekniikka
Supervising professor(s):	Ovaska, Seppo
Thesis advisor(s):	Kujala, Kauppi
Keywords:	ramp-up, printed circuit board assemblies, box-builds, EMS, OEM
Location:	P1 \| Archive
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Permanent link to this item: http://urn.fi/URN:NBN:fi:aalto-201506303502 Email this Export to RefWorks QR Code Print BibTex Tweet