D-Band Antenna and Array Designs for 5G Applications

Lamminen, Antti; Kaunisto, Mikko; Säily, Jussi; Kantanen, Mikko; Schober, Mario; Chico, Alberto; Ala-Laurinaho, Juha; Ermolov, Vladimir

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D-Band Antenna and Array Designs for 5G Applications

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Title:	D-Band Antenna and Array Designs for 5G Applications
Author(s):	Lamminen, Antti ; Kaunisto, Mikko ; Säily, Jussi ; Kantanen, Mikko ; Schober, Mario ; Chico, Alberto ; Ala-Laurinaho, Juha ; Ermolov, Vladimir
Date:	2023
Language:	en
Pages:	5 597-601
Department:	VTT Technical Research Centre of Finland AT&S: Advanced Technologies & Solutions TTI Norte Department of Electronics and Nanoengineering Department of Electronics and Nanoengineering
ISBN:	979-8-3503-1102-0
Series:	2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023
DOI-number:	10.1109/EuCNC/6GSummit58263.2023.10188240
Keywords:	antenna, antenna array, D-band, millimeter waves
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Citation: Lamminen , A , Kaunisto , M , Säily , J , Kantanen , M , Schober , M , Chico , A , Ala-Laurinaho , J & Ermolov , V 2023 , D-Band Antenna and Array Designs for 5G Applications . in 2023 Joint European Conference on Networks and Communications and 6G Summit, EuCNC/6G Summit 2023 . IEEE , pp. 597-601 , Joint European Conference on Networks and Communications and 6G Summit , Gothenburg , Sweden , 06/06/2023 . https://doi.org/10.1109/EuCNC/6GSummit58263.2023.10188240
Abstract: This paper presents the design, manufacturing and characterization of a parasitic patch microstrip D-band antenna and a 16-element segmented antenna array on a multilayer printed circuit board (PCB) targeted for 5G applications. The antennas are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measured maximum gains for a single antenna and a 16-element array are respectively 9 dBi and 16.5 dBi at 157 GHz. The measured antenna array input matching bandwidth is 20 GHz.

Description: Funding Information: This work was conducted within the framework of the H2020 DRAGON project, which is partially funded by the Commission of the European Union (Grant Agreement No. 955699). Publisher Copyright: © 2023 IEEE.
Permanent link to this item: http://urn.fi/URN:NBN:fi:aalto-202308305296 Email this Export to RefWorks QR Code Print BibTex Tweet