Hybrid Microassembly with Surface Tension Driven Self-alignment: Handling Strategies and Micro-fabricated Patterns

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.advisor Zhou, Quan, Assistant Professor, Aalto University, Department of Automation and Systems Technology, Finland
dc.contributor.author Chang, Bo
dc.date.accessioned 2013-08-22T09:00:15Z
dc.date.available 2013-08-22T09:00:15Z
dc.date.issued 2013
dc.identifier.isbn 978-952-60-5262-5 (electronic)
dc.identifier.isbn 978-952-60-5261-8 (printed)
dc.identifier.issn 1799-4942 (electronic)
dc.identifier.issn 1799-4934 (printed)
dc.identifier.issn 1799-4934 (ISSN-L)
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/10904
dc.description.abstract Hybrid microassembly combines self-assembly technology with traditional robotic pick-and-place technology or other robotic feeding mechanics to construct microsystems. In a typical hybrid microassembly process, a micro part is brought adjacent to the assembly site by a robot handling tool at a high speed but with a relatively low precision, and liquid droplets dispensed by a dispenser at the assembly site align the part at a higher precision. By combing both the robotic pick-and-place technique and self-assembly technique, hybrid microassembly technique can achieve high speed and high precision simultaneously. This thesis explores the adaptability of hybrid microassembly technique by investigating different hybrid microassembly methods and different types of the patterns. Three hybrid microassembly approaches have been investigated: 1) droplet assisted hybrid microassembly, 2) water mist induced hybrid microassembly and 3) hybrid microassembly with forced wetting. The droplet assisted hybrid microassembly has been studied using patterns with segments and patterns with jagged edges. Parallel microassembly of microchips with water mist induced hybrid microassembly has also been explored. Hybrid microassembly on hydrophobic receptor site with super-hydrophobic substrate has been experimentally investigated with two forced wetting techniques. Four different types of patterns have been investigated for hybrid microassembly technique: (a) oleophilic/phobic patterns, (2) hydrophobic/super-hydrophobic patterns, (3) segmented patterns and (4) patterns with jagged edges. Hybrid microassembly has been studied on a new patterned oleophilic/oleophobic surface using adhesive droplet in ambient air environment. A patterned hydrophobic/super-hydrophobic surface has also been investigated and hybrid microassembly has been demonstrated with both water and adhesive. Application relevant patterns such as segmented patterns and patterns with jagged edges have been investigated. In summary, this thesis shows that hybrid microassembly can adapt to large varieties of patterns. Several new hybrid microassembly methods are developed and demonstrated. Such a wide adaptability and a variety of the processes indicate that hybrid microassembly can be a very promising approach for many potential applications, such as integration of surface emitting lasers, integration of small dies and 3D integration of chips with high density pin counts. en
dc.format.extent 163
dc.format.mimetype application/pdf
dc.language.iso en en
dc.publisher Aalto University en
dc.publisher Aalto-yliopisto fi
dc.relation.ispartofseries Aalto University publication series DOCTORAL DISSERTATIONS en
dc.relation.ispartofseries 117/2013
dc.relation.haspart [Publication 1]: Bo Chang, Ali Shah, Iiris Routa, Harri Lipsanen, and Quan Zhou, “Surface-tension driven self-assembly of microchips on hydrophobic receptor sites with water using forced wetting,” Applied Physics Letters, vol. 101, no. 11, p. 114105, 2012.
dc.relation.haspart [Publication 2]: Bo Chang, Veikko Sariola, Susanna Aura, Robin H. A. Ras, Maria Klonner, Harri Lipsanen, and Quan Zhou, “Capillary-driven self-assembly of microchips on oleophilic/oleophobic patterned surface using adhesive droplet in ambient air,” Applied Physics Letters, vol. 99, no. 3, p. 034104, 2011.
dc.relation.haspart [Publication 3]: Bo Chang, Iiris Routa, Veikko Sariola, and Quan Zhou, “Self-alignment of RFID dies on four-pad patterns with water droplet for sparse self-assembly,” J. of Micromechanics and Microengineering, vol. 21, no. 9, p. 095024, 2011.
dc.relation.haspart [Publication 4]: Bo Chang, Veikko Sariola, Mirva Jääskeläinen, and Quan Zhou, “Self-alignment in the stacking of microchips with mist-induced water droplets,” J. of Micromechanics and Microengineering, vol. 21, no. 1, p. 015016, 2011.
dc.relation.haspart [Publication 5]: Ali Shah, Bo Chang, Sami Suihkonen, Quan Zhou, and Harri Lipsanen, “Surface-tension driven self-alignment of microchips on black silicon based hybrid template in ambient air,” J. of Microelectromechanical Systems, vol. 22, no. 3, p. 739-746, 2013.
dc.relation.haspart [Publication 6]: Bo Chang, Antti Virta, and Quan Zhou, “Hybrid microassembly for massively parallel assembly of microchips with water mist,” in Proc. Int. Conf. on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO'12, September, 2012, pp. 38-43.
dc.relation.haspart [Publication 7]: Bo Chang, Mirva Jääskeläinen, and Quan Zhou, “Hybrid microassembly of chips on low precision patterns assisted by capillary self-alignment,” in Proc. IEEE/RSJ Int. Conf. on Intelligent Robots and Systems, IEEE-IROS'11, October, 2011, pp. 907-912.
dc.relation.haspart [Publication 8]: Bo Chang, Ville Liimatainen, Iiris Routa, and Quan Zhou, “High-accuracy positioning of microchips on patterns with jagged edges using hybrid microassembly,” in Proc. IEEE Int. Conf. on Mechatronics and Automation, IEEE-ICMA'12, August, 2012, pp. 807-812.
dc.relation.haspart [Publication 9]: Bo Chang, Mirva Jääskeläinen, and Quan Zhou, “Hybrid micro assembly of microchips on segmented patterns,” in Proc. IEEE Int. Conf. on Automation Science and Engineering, IEEE-CASE'10, 2010, pp. 15-20.
dc.relation.haspart [Publication 10]: Bo Chang, Mirva Jääskeläinen, and Quan Zhou, “Microassembly combining pick-and-place and water mist,” in Int. Symposium on Micro-NanoMechatronics and Human Science, MHS'10, 2010, pp. 333-337.
dc.subject.other Automation en
dc.title Hybrid Microassembly with Surface Tension Driven Self-alignment: Handling Strategies and Micro-fabricated Patterns en
dc.type G5 Artikkeliväitöskirja fi
dc.contributor.school Sähkötekniikan korkeakoulu fi
dc.contributor.school School of Electrical Engineering en
dc.contributor.department Automaatio- ja systeemitekniikan laitos fi
dc.contributor.department Department of Automation and Systems Technology en
dc.subject.keyword hybrid microassembly en
dc.subject.keyword droplet self-alignment en
dc.subject.keyword surface tension en
dc.subject.keyword self-assembly en
dc.identifier.urn URN:ISBN:978-952-60-5262-5
dc.type.dcmitype text en
dc.type.ontasot Doctoral dissertation (article-based) en
dc.type.ontasot Väitöskirja (artikkeli) fi
dc.contributor.supervisor Koivo, Heikki, Prof., Aalto University, Department of Automation and Systems Technology, Finland
dc.opn Régnier, Stéphane, Professor, University of Pierre and Marie Curie, France
dc.opn Lambert, Pierre, Assistant Professor, Université libre de Bruxelles, Belgium
dc.date.dateaccepted 2013-06-14
dc.contributor.lab Micro- and Nanorobotics Group en
dc.contributor.lab Mikro- ja nanorobotiikka fi
dc.rev Régnier, Stéphane, Professor, University of Pierre and Marie Curie, France
dc.rev Tichem, Marcel, Associate Professor, Delft University of Technology, The Netherlands
dc.date.defence 2013-08-23


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