Creep effects in diffusion bonding of oxygen-free copper

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.advisor Alava, Mikko
dc.contributor.author Moilanen, Antti
dc.date.accessioned 2013-07-19T09:13:21Z
dc.date.available 2013-07-19T09:13:21Z
dc.date.issued 2013-04-17
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/10613
dc.format.extent 44
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.title Creep effects in diffusion bonding of oxygen-free copper en
dc.type G1 Kandidaatintyö fi
dc.contributor.school Perustieteiden korkeakoulu fi
dc.subject.keyword diffusion en
dc.subject.keyword diffusion bonding en
dc.subject.keyword creep en
dc.subject.keyword oxygen-free copper en
dc.subject.keyword finite element method en
dc.identifier.urn URN:NBN:fi:aalto-201307217358
dc.type.dcmitype text en
dc.programme.major Teknillinen fysiikka fi
dc.programme.mcode F3005 fi
dc.type.ontasot Bachelor's thesis en
dc.type.ontasot Kandidaatintyö fi
dc.contributor.supervisor Alava, Mikko
dc.programme Teknillinen fysiikka ja matematiikka TFM fi


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