Creep effects in diffusion bonding of oxygen-free copper

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Journal Title
Journal ISSN
Volume Title
Perustieteiden korkeakoulu | Bachelor's thesis
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Date
2013-04-17
Department
Major/Subject
Teknillinen fysiikka
Mcode
F3005
Degree programme
Teknillinen fysiikka ja matematiikka TFM
Language
en
Pages
44
Series
Description
Supervisor
Alava, Mikko
Thesis advisor
Alava, Mikko
Keywords
diffusion, diffusion bonding, creep, oxygen-free copper, finite element method
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Citation