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The Effects of Additives on the Electrodeposition of Copper Studied by Impedance Technigue

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.author Fabricius, Gunilla
dc.date.accessioned 2021-04-13T20:39:42Z
dc.date.available 2021-04-13T20:39:42Z
dc.date.issued 1984
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/104387
dc.format.extent 44 s. + liitt. 35
dc.language.iso en en
dc.title The Effects of Additives on the Electrodeposition of Copper Studied by Impedance Technigue en
dc.title Lisäaineiden vaikutukset kuparin sähkösaostamisessa näennäisvastustekniikalla fi
dc.contributor.school Teknillinen korkeakoulu fi
dc.contributor.school Helsinki University of Technology en
dc.contributor.department Kemian osasto fi
dc.identifier.urn URN:NBN:fi:aalto-202104133673
dc.programme.major Fysikaalinen kemia fi
dc.programme.mcode 5.31 fi
dc.type.ontasot Licentiate thesis en
dc.type.ontasot Lisensiaatintyö fi
dc.contributor.supervisor Sundholm, Göran
local.aalto.openaccess no
local.aalto.digifolder Aalto_28908
dc.rights.accesslevel closedAccess
local.aalto.idinssi 4396
dc.type.okm G3 Lisensiaatintutkimus
local.aalto.digiauth ask


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