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Browsing by Keyword "bonding"

Now showing items 1-19 of 19

Title: Active photonic crystals in indium phosphide membrane Author(s): Sihvonen, Olli Date: 2006 Helsinki University of Technology | Master's thesis
Title: Building social capital with mobile communication services Author(s): Karikoski, Juuso; Kilkki, Kalevi Date: 2013 Series: International Journal of Electronic Finance, Volume 7, Issue 2 School of Electrical Engineering
Title: Buried ion implanted layer in bonded silicon-on-insulator wafers Author(s): Honkanen, Jenni Date: 2011 School of Chemical Engineering | Master's thesis
Title: Connection design of prefabricated thin cold-formed steel wall elements Author(s): Seo, Myung Sik Date: 2009 Helsinki University of Technology | Master's thesis
Title: Cross-cultural similarity in relationship-specific social touching Author(s): Suvilehto, Juulia T.; Nummenmaa, Lauri; Harada, Tokiko; Dunbar, Robin IM; Hari, Riitta; Turner, Robin; Sadato, Norihiro; Kitada, Ryo Date: 2019-04-17 Series: PROCEEDINGS OF THE ROYAL SOCIETY B: BIOLOGICAL SCIENCES, Volume 286
Title: CTMP:n ja kartongin laadun välisten vuorovaikutusten analysointi tilastollisia analyysejä hyödyntäen Author(s): Ellilä, Mia Date: 2015-12-15 Kemian tekniikan korkeakoulu | Master's thesis
Title: The effect of peeling check depth on bond quality in birch plywood Author(s): Logrén, Janne Date: 2011 School of Chemical Engineering | Master's thesis
Title: Effect of physical and chemical phenomena in continuous cooking on softwood kraft pulp properties Author(s): Oksanen, Juha Date: 2003 Helsinki University of Technology | Master's thesis
Title: The effect of the humidity of the concrete on the bonding of the coating Author(s): Saarinen, Jarmo Date: 2010 School of Engineering | Master's thesis
Title: Fabrication of inorganic-organic hybrid polymer micro and nanostructures for fluidic applications Author(s): Aura, Susanna Date: 2011 Series: Aalto University publication series DOCTORAL DISSERTATIONS , 137/2011 Kemian tekniikan korkeakoulu | Doctoral thesis (article-based)
Title: Glass microprocessing for fluidic devices Author(s): Saarela, Ville Date: 2006 Helsinki University of Technology | Master's thesis
Title: Interfibre bonding and fibre segment activation in paper : observations on the phenomena and their influence on paper strength properties Author(s): Vainio, Anna Date: 2007-11-30 Series: Reports / Helsinki University of Technology, Laboratory of Paper and Printing Technology. Series A, 29 | Doctoral thesis (article-based)
Title: Modification of paperboard sheet extensibility by inter-fiber bonding and strength agents Author(s): Kvist, Markus Date: 2016-12-13 Kemian tekniikan korkeakoulu | Master's thesis
Title: On structure and rate dependence of Perniö clay Author(s): Mataić, Igor Date: 2016 Series: Aalto University publication series DOCTORAL DISSERTATIONS, 8/2016 School of Engineering | Doctoral thesis (monograph) | Defence date: 2016-01-15
Title: On the beating of reinforcement pulp Author(s): Hiltunen, Eero Date: 2003-01-24 Series: Reports / Helsinki University of Technology, Laboratory of Paper Technology. Series A, 16 | Doctoral thesis (article-based)
Title: Qualitative findings from a systematic review Author(s): Tomlinson, Alan; Lane, Jack; Julier, Guy; Grigsby-Duffy, Lily; Payne, Annette; Mansfield, Louise; Kay, Tessa; John, Alistair; Meads, Catherine; Daykin, Norma; Golding, Alex; Victor, Christina Date: 2020-11-01 Series: JOURNAL OF APPLIED ARTS AND HEALTH, Volume 11, issue 3
Title: Quality specifications of hot dip galvanized reinforcement to ensure the objective service life Author(s): Peltola, Susanna Date: 2001 Helsinki University of Technology | Master's thesis
Title: Solid-liquid interdiffusion bonding for MEMS device integration Author(s): Rautiainen, Antti Date: 2018 Series: Aalto University publication series DOCTORAL DISSERTATIONS, 207/2018 School of Electrical Engineering | Doctoral thesis (article-based) | Defence date: 2018-11-02
Title: Test structure design and verification of Cu-Sn bonds manufactured by transient-liquid phase bonding Author(s): Heikkilä, Niklas Date: 2018-10-08 Sähkötekniikan korkeakoulu | Master's thesis