Browsing by Author "Reponen, Kia"
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Helsinki University of Technology | Master's thesis(2004) Reponen, KiaProducts being transported around the world need to be packaged. When designing a transport package, the product and its distribution environment define the package performance requirements. Package design is a part of the product development process, where in addition to designing a new product its package is also developed. This thesis is concerned with packaging frequency converters and designing their packaging, as well as with the realization of packaging projects in the Component AC profit centre of ABB Drives. The objective of this thesis is to study the packages and package design methods used in Component AC and to identify the problems existing in this area. The aim is also to present solutions for integrating the package design process into the product development process of ABB Drives. An overview of the theory related to package design is given in this thesis. This includes the legislative and environmental requirements as well as the technical considerations of designing cushioning and cartons. In addition, the topics of choosing packaging materials and package performance testing are discussed. Some alternatives to minimize environmental effects of packages currently used in Component AC are also presented. Packages are the pitfall of product development projects in Component AC. This is due to the fact that the work on packaging is started far too late in the project. As a result, the product is finished before the package and the whole project is delayed. Trying to design a package in a short period of time means spending more money and compromising on package features. If the package was designed simultaneously with the product, the package and the product would be ready for release at the same time. Using technologies of virtual 3D design and the internet would allow package and product designers to collaborate more effectively and enable them to start the package design process in the early stages of product development. High packaging costs and environmental considerations are common reasons for contemplating the introduction of new and alternative packaging materials. This thesis includes package performance testing of alternative packaging concepts that would bring many benefits compared with Component AC's current packages.